COOL: A Cooling-Aware Point Transformer Framework for Thermal Prediction in Advanced 3D/3.5D IC PackagingApr 1, 2026ยทYao Lu,Zhicheng Guo,Qijun Zhang,Ziyan Guo,Shang LiuWenji Fang,Wenkai Li,Zhiyao Xieยท 0 min read CiteTypeConference paperPublicationIn Design Automation ConferenceLast updated on May 13, 2026 AuthorsWenji FangPhD Student LEAP: A Self-Supervised Per-Cycle Toggle Propagation Model Supports Fast, Transferable, and Early Analysis of Layout Power Apr 1, 2026 →